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Welcome to our Product/Process Change Notification (PCN) pages dating back to year 2002. To locate PCNs, please select year at right.
Each PCN provides Contact and Implementation Dates, Alert Category and Type, PCN Number, Title, Impact, Description of Change, and a complete list of products manufactured by Diodes, Inc. that are affected by the product/process changes indicated. To view PCN, please click PCN# .
To Automatically Receive PCN Notification / E-mail Alerts
Product/Process Change Notifications
| PCN# |
Implementation Date |
Alert Category |
Title (Abbreviated) |
Description Summary |
| PCN-2022 |
August 16, 2010 |
Discrete |
Products identified in this PCN will no longer be available from Diodes Inc. For some products, replacement parts are being
offered and are available for immediate substitution. |
Products listed in Tables 1 – 3 will no longer be available from Diodes Inc. For some products, replacement parts are being
offered and are available for immediate substitution. Life-time buy orders must be placed by 8th October, 2010. All shipments
will be made on or before 7th November, 2010. Please contact your local Diodes representatives for life-time buy opportunities
and further information. |
| PCN-2017 |
October 13, 2010 |
Discrete Semiconductors |
Qualification of Additional Wafer Sources or Die Shrink |
In order to assure continuity of supply, this PCN is being issued to notify customers of the qualification of Diodes FabTech
(KFAB) and Diodes/Zetex (OFAB) wafer fabrication sites in addition to the currently qualified wafer fabrication site (Phenitec).
Some select devices will be qualified with a smaller die size within the existing wafer fabrication site (Phenitec). Affected
products are listed in the attached table.
Full electrical characterization and high reliability testing will be completed on representative parts to ensure no change to
device functionality or data sheet electrical specifications.
There is no change to Form, Fit or Function. |
| PCN-2013 |
September 10, 2010 |
Analog and Discrete |
Device End of Life |
Products listed in Table 1-4 will not longer be available from Diodes Inc. For some products, replacement parts are being offered and are available for immediate substitution. Life-time buy orders must be placed by 31st July, 2010. All shipments will be made on or before 30th August, 2010. Please contact your local Diodes representatives for life-time buy opportunities and further information.
Table 1 - Analog EOL Devices With No Replacements
Table 2 - Discrete EOL Devices With No Replacements
Table 3 - Analog EOL Devices With Suggested Replacements
Table 4 - Discrete EOL Devices With Suggested Replacements |
| PCN-2016 |
September 1st, 2010 |
AH28x and AH29x Series |
Conversion of AH28x and AH29x Series to Green Mold Compound |
The mold compound for the products listed below is being converted from non-Green to Green. Non-Green part numbers will
become obsolete by 1st September, 2010. Full electrical characterization and high reliability testing have been
completed on representative devices from the affected package family to ensure there is no change to device
functionality, data sheet electrical specifications, or package performance.
A life-time buy opportunity is being provided until 2nd August, 2010. The last shipment date for non-Green product is 1st September, 2010. |
| PCN-2015 |
September 2, 2010 |
SBR ITO-220AB and TO-220AB Packages |
Qualify Treasurestar as an Additional Assembly and Test Site for Super Barrier Rectifiers (SBR) products in ITO-220AB and TO-220AB Packages |
In order to maintain continuity of supply, Treasurestar is being qualified as an additional assembly and test site for the SBR
TO-220AB and ITO-220AB Packages. Customers will receive parts from Treasurestar along with the currently approved
suppliers. Full electrical characterization and high reliability testing will be completed on representative devices from the
affected package family to ensure there is no change to device functionality, data sheet electrical specifications, or package
performance. |
| PCN-2010 |
July 30, 2010 |
NPN RF Transistors |
EOL (End of Life) notification for BFS17HTA, FST634TA, and ZUMTS17HTA |
Die used in the manufacturing of the BFS17HTA, FST634TA, and ZUMTS17HTA are no longer available. Alternate part
numbers using a different die are available as a replacement option. Performance differences between the devices being
discontinued and the replacement devices are highlighted in the attached document. The datasheets for the suggested
replacement part numbers are also attached.
No life-time buy opportunity is available for the affected EOL part numbers. |
| PCN-2014-I |
July 30, 2010 |
D2PAK Package |
EOL (End of Life) Notification and Assembly and Test Site Transfer for the D2PAK Package Products |
The current assembly and test facility for the D2PAK packaged products (listed below) is discontinuing manufacturing of these
products. In order to maintain continuity of supply, assembly and test of some part numbers is being qualified at Diodes’
SKE/DSH facility (Table 1). The remainder of the parts will no longer be available, but Diodes Incorporated is offering
replacement parts for some of these devices (Table 3). For parts that will no longer be available without replacement parts, a
life-time buy opportunity is being provided until June 30th, 2010 (Table 2). The last shipment date for all parts from the current
assembly and test site is July 30th, 2010.
For parts that are being qualified at Diodes’ SKE/DSH facility, full electrical characterization and high reliability testing will be
completed on representative devices from the affected package family to ensure there is no change to device functionality,
data sheet electrical specifications, or package performance. Replacement parts that are being offered have already been
qualified. |
| PCN-2007 |
November 10, 2010 |
NPN Bipolar Junction Transistors |
Qualification of Additional Wafer Fabrication Facility for NPN bipolar junction transistors. |
In order to assure continuity of supply, this PCN is being issued to notify customers that Diodes Incorporated has qualified an
additional wafer fabrication facility, Diodes FabTech (KFAB), for the manufacture of Diodes NPN Bipolar Junction Transistors,
as listed in the attached table.
Full electrical characterization and high reliability testing has been completed on representative qualification vehicles to ensure
that no changes in product reliability, device functionality or data sheet electrical specifications exist.
There is no change to Form, Fit or Function. |
| PCN-2001 |
Immediate |
Schottky Diodes |
ZLLS1000TA, ZLLS2000TA, and ZLLS410TA Datasheet Specification Change |
Updates to the manufacturing environments have led to the necessity of an increase of specification limits for certain parameters to aid in
manufacturability and capability. Differences between the previous version and the current version are high-lighted in the attached documents. |
| PCN-2000 |
September 12th 2010 |
Discrete Devices in SOT23 Package |
Additional Assembly Location AUK Dalian, China for SOT23 Package |
This PCN is being issued to notify customers that Diodes Incorporated has qualified AUK in Dalian, China as a new assembly facility in order to assure continuity of supply for the SOT23 packages. Full electrical characterization and high reliability testing will be completed on representative devices from the affected package family to ensure there is no change to device functionality, data sheet electrical specifications, or package performance. |
| PCN-1158 |
January 13, 2010 |
Discrete Semiconductors |
Device EOL |
The products listed below are discontinued and no last-time-buy opportunity can be offered. |
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