LOCATION: 1545 Barber Lane, Milpitas, CA 95035
DUTIES: Perform and manage the product schedule from the product definition, cost analysis, project schedule, new product characterization, qualification and release to market, and maintain product support in terms of yield and customer issues.
Use fundamentals of Complementary Metal-Oxide Semiconductor (CMOS) technology, qualification, device characterization and report generation. Construct, test and trouble-shoot characterization boards; knowledge of using lab equipment. Serve as the central resource for design, process, manufacturing, test, quality and marketing as the product(s) move to production and distribution. Active involvement throughout all stages of a product’s lifecycle including modifications, upgrades and maintenance of product or production line.
Manage projects effectively with internal and external customers to release new product on schedule. Responsible for components level reliability test and work with Failure Analysis Engineer for qualification failure unit. Interface with designer on product related issues. Perform bench testing setup for DC parameter such as IDD, RON, leakage and threshold. Responsible for the signal integrity measuring using network parameter analyzer, JBERT and Oscilloscope. Perform Die and Package qualification process using High Temperature Operating Life (HTOL), Early Life Failure Rate (ELFR), High Temperature Storage Life (HTSL), Biased Highly Accelerated Stress Test (BHAST), Unbiased Highly Accelerated Stress Test (UHAST) and Temperature Cycle (TC) test. Responsible for different kinds of Integrated Circuit products from High Speed Interface, High Voltage Logic to Clock.
REQUIREMENTS: Bachelor’s or foreign equivalent degree in Electrical Engineering, Computer Engineering, or a related field and 2 years of experience in the job offered or as a Product Engineer, Manufacturing Engineer, Process Improvement Engineer, or in a related/similar position.
Experience therein to include 2 years using fundamentals of CMOS technology, qualification, device characterization and report generation; 1 year using bench testing setup for DC parameter such as IDD, RON, leakage and threshold; performing signal integrity measuring using network parameter analyzer, JBERT and Oscilloscope; Die and Package qualification process using HTOL, ELFR, HTSL, BHAST, UHAST and TC test; using different kinds of Integrated Circuit products from High Speed Interface, High Voltage Logic to Clock; manage the product schedule from the product definition, cost analysis, project schedule, characterization, qualification and release to market.
In lieu of a Bachelor’s degree and 2 years of experience, employer will accept a Master’s or foreign equivalent degree in Electrical Engineering, Computer Engineering, or a related field, and experience, college project experience, or college course work using fundamentals of CMOS technology, qualification, device characterization and report generation; using bench testing setup for DC parameter such as IDD, RON, leakage and threshold; performing signal integrity measuring using network parameter analyzer, JBERT and Oscilloscope; Die and Package qualification process using HTOL, ELFR, HTSL, BHAST, UHAST and TC test; using different kinds of Integrated Circuit products from High Speed Interface, High Voltage Logic to Clock; manage the product schedule from the product definition, cost analysis, project schedule, characterization, qualification and release to market.
RATE OF PAY: $107,702 to $109,000 per year
CONTACT: To apply, email resume to us_hr_jobs@diodes.com. Please refer to code CBLIW-W
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