Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.
TO252-DPAK.pngHigh current, Wide Vin, 800 mA LDO
Contact Sales
Log in or register to manage email notifications about changes to datasheets or PCNs for this part.
The AZ1117C is a low dropout three-terminal regulator.
The AZ1117C has been optimized for low voltage where transient response and minimum input voltage are critical. It provides current limit and thermal shutdown. Its circuit includes a trimmed bandgap reference to assure output voltage accuracy to be within ±1%. On-chip thermal shutdown provides protection against a combination of high current and ambient temperature that would create excessive junction temperature.
The AZ1117C is available in 1.2V, 1.5V, 1.8V, 2.5V, 3.3V, 5.0V fixed output voltage versions and ADJ output voltage version. The fixed versions integrate the adjust resistors. It is also available in an adjustable version which can set the output voltage with two external resistors.
The AZ1117C is available in the industry-standard TO2522 (3), TO2522 (4), and TO2522 (5), SOT89-3L and SOT223 power packages.
| Iq (max) (µA) | 6000 |
|---|---|
| Iq (typ) (µA) | 4000 |
| AEC Qualified | No |
| Compliance (Only Automotive supports PPAP) | Standard |
| Type | LDO |
| Output options | Adjustable & Fixed |
| Iout (A) | 0.8 |
| Vin (Max) (V) | 15 |
| Vin (Min) (V) | 3.2 |
| Vout (min) | 1.25 |
| Fixed Vout (V) | 1.2, 1.5, 1.8, 2.5, 3.3, 5.0 |
| Adjustable VFB (V) | 1.25 |
| Accuracy 25C | 1 |
| Noise uV RMS 10-100 kHz | 150 |
| VDROPOUT (Max) (V) at Max Current and Max Ouput Voltage | 1.4 |
| PSRR (dB) 1kHz | 70 |
| Operating Temperature (Ambient) (°C) | -20 to 125 |
| Enable Active | No |
| Channels | 1 |
| Output Discharge | No |
| Power Good | No |
| Reverse Protection | No |
| VCTL Function | No |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2568 | 2022-03-29 | 2022-03-29 | Qualified Additional Assembly & Test (A/T) Sites, Bill of Material, and updated Data Sheets for Package Outline Dimension Change |
| PCN-2514 | 2021-03-09 | 2021-06-09 | Additional Wafer Source JKFAB |
| PCN-2331 | 2018-03-22 | 2018-06-22 | Additional Qualified BOM (Bill of Materials) on Selected Devices |
