B0520WS

Schottky

Datasheet

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Feature(s)

Low Forward Voltage Drop
Guard Ring Die Construction for Transient Protection
High Conductance
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200,
PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Qsuffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/.
This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Product Specifications

Product Parameters

AEC Qualified	Yes
Compliance (Only Automotive supports PPAP)	Standard
Configuration	Single
MaximumAverageRectifiedCurrent I_O(A)	0.5 A
@ TerminalTemperature TT (ºC)	N/A ºC
Peak RepetitiveReverse VoltageV_RRM(V)	20 V
Peak ForwardSurge CurrentI_FSM(A)	2 A
Forward VoltageDrop V_F(V)	0.43 V
@ I_F(A)	0.5 A
Maximum ReverseCurrent I_R(µA)	250 µA
@ V_R(V)	20 V
TotalCapacitance C_T(pF)	58 pF

Technical Documents

SPICE Model

B0520WS.spice.txt

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

RoHSFile

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2623	2023-05-15	2023-11-15	Device End of Life (EOL)
PCN-2562	2022-01-04	2022-04-04	Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products
PCN-2477	2020-08-17	2021-05-09	Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi
PCN-2459	2020-05-28	2020-11-28	Device End of Life (EOL)