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BAV99

Dual Surface Mount Switching Diode

Datasheet

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Feature(s)

Fast Switching Speed
Surface-Mount Package Ideally Suited for Automated Insertion
For General-Purpose Switching Applications
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
The BAV99Q is suitable for automotive applications requiring specific change control; this part is AEC-Q101 qualified, PPAP capable, and manufactured in IATF 16949 certified facilities. https://www.diodes.com/quality/product-definitions/

Product Specifications

Product Parameters

AEC Qualified	Yes
Compliance (Only Automotive supports PPAP)	Standard
Configuration	Dual, Series
Polarity	Anode, Cathode
Power Rating(mW)	350 mW
ESD Diodes (Y\|N)	No
Peak RepetitiveReverse VoltageV_RRM(V)	75 V
Reverse RecoveryTime trr (ns)	4 ns
Maximum Average Rectifier Current I_{O (mA)}	300 mA
Maximum Peak Forward Surge Current I_{FSM (A)}	2 A
Forward Voltage Drop V_F @ I_{F (mA)}	1 mA
Maximum ReverseCurrent I_R(µA)	2.5 µA
TotalCapacitance C_T(pF)	2 pF
VF(V) Max @ IF=100mA	1.2
V(BR)R (V) Min @IR=100μA	75@2.5μA
Trr(ns) Max @ IF=IR=10 mA, Irr=0.1xIR, RL=100Ω	4
Maximum Reverse Current I_R @ V_{R (V)}	75 V
VF(V) Max @ IF=1.0mA	0.82
VF(V) Max @ IF=10mA	0.82
IR(nA) Max @ VR=5V	10
IR(µA) Max @ VR=30V	0.1
IR(uA) Max @ VR=80V	2.5uA@75V
CT(pF) Max @ VR = 0V, f = 1MHz	2

Technical Documents

SPICE Model

BAV99.spice.txt

MDS Reports

BAS16_31_BAV70_99-MDS.pdf (17 KB)

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

RoHSFile

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2690	2024-05-29	2024-08-29	Qualification of Diodes’ subcontractor Eris Technology Corporation (Eris) in Taoyuan, Taiwan as Additional Assembly & Test Site and Diodes internal JKFAB in HsinChu, Taiwan as additional wafer source for Select Discrete Products.
PCN-2491	2020-11-17	2021-05-17	Device End of Life (EOL)
PCN-2459	2020-05-28	2020-11-28	Device End of Life (EOL)
PCN-2461	2020-05-08	2021-04-05	Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site
PCN-2315	2018-03-09	2018-06-09	Qualification of Alternative Wafer Sources for Select Products Due to Closure of Diodes FabTech (KFAB) Facility