Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.

SOD123-3D-image.png

Back to Zener Diodes

BZT52C30Q

SURFACE MOUNT ZENER DIODE

Datasheet

Contact Sales

Description

SURFACE MOUNT ZENER DIODE

Feature(s)

Planar Die Construction
500mW Power Dissipation
General Purpose, Medium Current
Ideally Suited for Automated Assembly Processes
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Notes 3 & 4)
Qualified to AEC-Q101 Standards for High Reliability

Product Specifications

Product Parameters

AEC Qualified	Yes
Compliance (Only Automotive supports PPAP)	Automotive
Configuration	Single
Power Rating(mW)	500
Nom V_{Z (V)}	30
@ I_{ZT (mA)}	2 mA
Tol V (Typ) (%)	6.67 %
I_{R (µA)}	0.1 µA

Technical Documents

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

RoHSFile

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2694	2024-08-14	2024-11-12	Additional Wafer Sources and Transfer of Wafer Manufacturing Site for Select Discrete Automotive Products
PCN-2462	2020-05-08	2021-04-11	Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive)
PCN-2319	2018-03-09	2018-06-09	Qualification of Alternative Wafer Sources for Select Automotive Products Due to Closure of Diodes FabTech (KFAB) Facility