Diodes Incorporated — Analog and discrete power solutions
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BZT52C6V2Q

SURFACE MOUNT ZENER DIODE

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Description

SURFACE MOUNT ZENER DIODE

Feature(s)

  • Planar Die Construction
  • 500mW Power Dissipation
  • General Purpose, Medium Current
  • Ideally Suited for Automated Assembly Processes
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Notes 3 & 4)
  • Qualified to AEC-Q101 Standards for High Reliability

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive supports PPAP) Automotive
Configuration Single
Power Rating(mW) 500
Nom VZ (V) 6.2
@ IZT (mA) 5 mA
Tol V (Typ) (%) 6.45 %
IR (µA) 3 µA

Related Content

Packages

Technical Documents

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2656 2023-12-20 2024-03-20 Qualification of Additional Wafer Source Using Different Back Metal Composition and Thickness, and Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using Different Back Metal Composition and Thickness, PdCu Bond Wire, New Lead Frame, New Mold Compound Types for Select Automotive Products.
PCN-2545 2021-10-05 2022-01-05 Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Automotive Products
PCN-2462 2020-05-08 2021-04-11 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive)
PCN-2319 2018-03-09 2018-06-09 Qualification of Alternative Wafer Sources for Select Automotive Products Due to Closure of Diodes FabTech (KFAB) Facility