Diodes Incorporated — Analog and discrete power solutions
PowerDI3333 8

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DMG7702SFG (NRND)

NRND = Not Recommended for New Design

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Description

This new generation 30V N channel enhancement mode MOSFET DIOFET utilizes a unique patented process to monolithically integrate a MOSFET and a Schottky in a single die to deliver:

Application(s)

  • Backlighting
  • Power Management Functions
  • DC-DC Converters

Product Specifications

Product Parameters

Compliance (Only Automotive supports PPAP) On Request
CISS Condition @|VDS| (V) N/A
CISS Typ (pF) N/A
CISS Typ @ VDS = 15V (pF) 1296
Config/ Polarity N Channel
ESD Diodes (Y|N) No
|IDS| @TA = +25°C (A) 12
|IDS| @TC = +25°C (A) N/A
PD @TA = +25°C (W) 2.2
PD @TC = +25°C (W) N/A
Polarity N
QG Typ @ VGS = 10V (pF) 31.6
QG Typ @ |VGS| = 10V (nC) 31.6
QG Typ @ |VGS| = 4.5V (nC) 14.7
QG Typ @ VGS = 5V(nC) N/A
AEC Qualified Yes
RDS(ON)Max@ VGS(1.8V)(mΩ) N/A
RDS(ON)Max@ VGS(10V)(mΩ) 10
RDS(ON)Max@ VGS(2.5V)(mΩ) N/A
RDS(ON)Max@ VGS(4.5V)(mΩ) 15
|VDS| (V) 30
|VGS| (±V) 20
|VGS(TH)| Max (V) 2.5

Related Content

Packages

Technical Documents

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2456 2020-05-29 2020-08-29 Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site Using Copper or Palladium Coated Copper Bond Wire with Standardization of Assembly Bill of Materials, Or as an Additional Wafer Plating, Back Grinding and Back Metal Process Source, and Qualification of Additional Wafer Source for Select Discrete Products.
PCN-2389 2019-02-05 2019-08-05 Device End of Life