SINGLE CHANNEL SMART LOAD SWITCH
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The DML1010FDK is a single channel load switch with very low on-resistance in a small package. It contains an N-channel MOSFET for up to VVBIAS-1.5V input voltage operation and 6A current channel with 3.2V to 5.5V bias supply. The load switch is controlled by a low voltage control signal through ON pin.
• Low RDS(ON)—Ensures On State Losses Are Minimized
• 0.8V to VVBIAS-1.5V Input Voltage Range
• 6A Continuous Current
• Low RDS(ON) Internal NFETs 8mΩ at VBIAS = 5V, VIN = 1.05V, TA = +85°C
• 35μA Low Quiescent Current
• 10μs Turn On Rise Time
• 3.2V to 5.5V Bias Voltage
• Integrated Quick Output Discharge Resistor
• Moisture Sensitivity: Level 1 per J-STD-020
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• Portable Electronics and Systems
• Notebook and Tablet Computers
• Telecom, Networking, Medical, and Industrial Equipment
• Set−Top Boxes, Servers, and Gateways
• SSD
Type | Load Switch |
---|---|
AEC Qualified | No |
Compliance (Only Automotive supports PPAP) | Standard |
Maximum Continuous Output Current (A) | 6 |
(MAX) Maximum Current Limit Fixed (A) | Not Limited |
Adjustable Current Limit | No |
Channels | 1 |
Enable Logic | Active High |
Minimum Operating Voltage (V) | 0.8 |
Maximum Operating Voltage (V) | 4 |
Quiescent Current Typ (µA) | 35 |
RDS(ON) (VIN = 5V) Typ (mΩ) | 8 (Max.) |
Reverse Current Block | No |
Minimum Power Supply Voltage (V) | 3.2 |
Maximum Power Supply Voltage (V) | 5.5 |
Output Discharge | Yes |
(TYP) Output Rise Time mS | 0.01 |
OCP Output Latch Off | No |
OCP/SCP | No |
OCP Flag | No |
Power Good | No |
Operating Ambient Temperature Range (°C) | -40 to 85 |
Overtemperature Protection | No |
UL Certificate | No |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
PCN # | Issue Date | Implementation Date | Subject |
---|---|---|---|
PCN-2495 | 2021-03-31 | 2021-07-01 | Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products |