Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.
SOT23.pngN-CHANNEL ENHANCEMENT MODE MOSFET
Contact Sales
Log in or register to manage email notifications about changes to datasheets or PCNs for this part.
| AEC Qualified | Yes |
|---|---|
| Compliance (Only Automotive(Q) supports PPAP) | Standard |
| Polarity | N |
| ESD Diodes (Y|N) | Yes |
| |VDS| (V) | 50 V |
| |VGS| (±V) | 20 ±V |
| |IDS| @TA = +25°C (A) | 0.5 |
| PD @TA = +25°C (W) | 0.54 |
| RDS(ON)Max@ VGS(10V)(mΩ) | 1600 mΩ |
| RDS(ON)Max@ VGS(4.5V)(mΩ) | 2500 mΩ |
| RDS(ON)Max@ VGS(2.5V)(mΩ) | 4500 mΩ |
| |VGS(TH)| Max (V) | 1.5 V |
| QG Typ @ |VGS| = 4.5V (nC) | 0.6 nC |
| CISS Typ (pF) | 46 pF |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2690 | 2024-05-29 | 2024-08-29 | Qualification of Diodes’ subcontractor Eris Technology Corporation (Eris) in Taoyuan, Taiwan as Additional Assembly & Test Site and Diodes internal JKFAB in HsinChu, Taiwan as additional wafer source for Select Discrete Products. |
| PCN-2458 | 2020-07-01 | 2020-10-01 | Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products |
| PCN-2403 | 2019-03-25 | 2019-06-19 | Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, Additional Wafer Source, or Additional Assembly and Test site for Select Products. |
