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DMP10H4D2S

P-CHANNEL ENHANCEMENT MODE MOSFET

Datasheet

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Description

This new generation MOSFET is designed to minimize the on-state resistance (R_DS(ON)) yet maintain superior switching performance, making it ideal for high-efficiency power-management applications.

Feature(s)

Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Small Surface-Mount Package
ESD Protected up to 2KV (HBM)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/
An automotive-compliant part is available under separate datasheet (DMP10H4D2SQ)

Application(s)

DC-DC converters
Power-management functions
Battery-operated systems and solid-state relays
Drivers: relays, solenoids, lamps, hammers, displays, memories, transistors, etc

Product Specifications

Product Parameters

AEC Qualified	Yes
Compliance (Only Automotive(Q) supports PPAP)	Standard
Polarity	P
ESD Diodes (Y\|N)	Yes
\|V_DS\| (V)	100 V
\|V_GS\| (±V)	20 ±V
\|I_DS\| @T_A = +25°C (A)	0.27
P_D @T_A = +25°C (W)	0.44
R_DS(ON)Max@ V_GS(10V)(mΩ)	4200 mΩ
R_DS(ON)Max@ V_GS(4.5V)(mΩ)	5000 (@ 4V) mΩ
\|V_GS(TH)\| Max (V)	3 V
Q_G Typ @ \|V_GS\| = 10V (nC)	1.8 nC
C_ISS Typ (pF)	87 pF
C_ISS Condition @\|V_DS\| (V)	25 V

Technical Documents

SPICE Model

DMP10H4D2S.spice.txt

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2617	2023-05-03	2023-08-03	Addition of a Polyimide Wafer Coating Layer and Enhanced ESD Structure for DMP10H4D2S Products
PCN-2495	2021-03-31	2021-07-01	Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products
PCN-2458	2020-07-01	2020-10-01	Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products