Diodes Incorporated — Analog and discrete power solutions
Back to Transistor (BJT) Master Table

DSS2540M

NPN, 40V, 0.5A, DFN1006-3

Contact Sales

Log in or register to manage email notifications about changes to datasheets or PCNs for this part.

Feature(s)

  • BVCEO > 40V
  • IC = 500mA High Collector Current
  • ICM = 1A Peak Pulse Current
  • PD = 1000mW Power Dissipation
  • Low Collector-Emitter Saturation Voltage, VCE(sat)
  • 60mm2 Package Footprint, 13 Times Smaller than SOT23
  • 5mm Height Package Minimizing Off-Board Profile
  • Complementary NPN Type DSS3540M
  • Totally Lead Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. "Green" Device (Note 3)
  • For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/
  • This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Product Specifications

Product Parameters

Category Low Saturation Transistor
Compliance(Only Automotive supports PPAP) Standard
Polarity NPN
VCEO, VCES (V) 40
IC (A) 0.5
ICM (A) 1
PD (W) 0.4
hFE (Min) 150
hFE (@ IC) (A) 0.1
hFE(Min 2) 50
hFE (@ IC2) (A) 0.5
VCE(sat) Max (mV) 200
VCE(SAT) (@ IC/IB) (A/mA) 0.2/10
VCE(sat) (Max.2) (mV) 250
VCE(sat) (@ IC/IB2) (A/mA) 0.5/50
fT (MHz) 300
RCE(sat) (mΩ) 500

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2299 2018-03-01 2018-06-01 Additional Qualified (A/T) Assembly Test Site
PCN-2305 2018-02-28 2018-05-28 Addition of A Passivation Layer Over The Top Metal of The Die for Selected BJT Devices