switching diode
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High-voltage Surface Mount Dual Switching Diode
• Fast Switching Speed: Maximum of 50ns
• High Reverse Breakdown Voltage: 300V
• Low Leakage Current: Maximum of 100nA when VR = 240V at Room Temperature
• Surface Mount Package Ideally Suited for Automated Insertion
• Dual Series Configuration
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• Qualified to AEC-Q101 Standards for High Reliability
AEC Qualified | Yes |
---|---|
Compliance (Only Automotive supports PPAP) | Automotive |
Configuration | Dual, Series |
Polarity | Anode, Cathode |
Power Rating(mW) | 350 mW |
ESD Diodes (Y|N) | No |
Peak RepetitiveReverse VoltageVRRM (V) | 300 V |
Reverse RecoveryTime trr (ns) | 50 ns |
Maximum Average Rectifier Current IO (mA) | 225 mA |
Maximum Peak Forward Surge Current IFSM (A) | 4 A |
Forward Voltage Drop VF @ IF (mA) | 1 mA |
Maximum ReverseCurrent IR (µA) | 0.1 µA |
TotalCapacitance CT (pF) | 5 pF |
VF(V) Max @ IF=100mA | 1 |
V(BR)R (V) Min @IR=100μA | 300 |
Trr(ns) Max @ IF=IR=10 mA, Irr=0.1xIR, RL=100Ω | 50 |
Maximum Reverse Current IR @ VR (V) | 240 V |
VF(V) Max @ IF=10mA | 0.855 |
IR(uA) Max @ VR=80V | 100nA@240V |
CT(pF) Max @ VR = 0V, f = 1MHz | 5 |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
PCN # | Issue Date | Implementation Date | Subject |
---|---|---|---|
PCN-2545 | 2021-10-05 | 2022-01-05 | Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Automotive Products |
PCN-2462 | 2020-05-08 | 2021-04-11 | Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive) |
PCN-2319 | 2018-03-09 | 2018-06-09 | Qualification of Alternative Wafer Sources for Select Automotive Products Due to Closure of Diodes FabTech (KFAB) Facility |