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PI3USB102E

Dual SPDT for USB 2.0 HS Compliance and Flow Through Pinout with 5V Protection

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Product Description

The PI3USB102E is a single differential channel 2:1 multiplexer/ demultiplexer USB 2.0 Switch. Industry leading advantages include a propagation delay of 250ps, resulting from its low channel resistance and I/O capacitance. PI3USB102E is bidirectional and offers very little attenuation of high-speed signals. It is designed for low bit-to-bit skew, high channel-to-channel noise isolation and is compatible with various standards, such as High Speed USB 2.0 (480 Mb/s). The PI3USB102E offers over voltage protection for the Y+/Y- pins as per the USB 2.0 specification. With the chip powered on or off if Y+/Y- pins are shorted to VBUS (5V +/- 5%), M+/M- and D+/Doutputs are clamped to provide voltage protection for downstream devices.

Features

  • USB 2.0 compliant (high speed, full speed, and low speed)
  • RON: 4.0Ω typical @ VDD = 3.0V
  • Channel On Capacitance: 6.0pF
  • Wide -3dB Bandwidth: 1,000MHz
  • Low bit-to-bit skew
  • Low Crosstalk: -29B @ 480 Mbps
  • Off Isolation: -28dB @ 480 Mbps
  • Near-Zero propagation delay: 250ps
  • Support 1.8-V logic on control pins
  • VDD Operating Range: 3.0V to 5.5V
  • ESD: 8kV HBM on Y+/Y- pins per JESD22 standard
  • Y+/Y- pins have over-voltage protection and can tolerate a short to VBUS
  • Packaging (Pb-free & Green): 10-contact TQFN, 1.3mm x 1.6mm x 0.75mm (ZL10)

Application

  • Routes signals for USB 2.0
  • PC, Notebooks and Hand-held devices

Product Specifications

Product Parameters

Configuration 1-Differential Channel 2:1
Differential Channels N/A
HotInsertion 0
Lanes 1
OtherFeatures N/A
Rail-to-Rail 0
Signal Type Differential
Single Ended Channels N/A
Type SPDT
Voltage 3.3

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2651 2023-11-13 2023-11-13 Qualified Additional Fab Source, Assembly Test Sites, Die Revision, BOM, Datasheet, Tape and Reel Packing Quantity.