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W QFN5050 32

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PI6CBE33045

Low-Power 4-Output ZDB / Fanout Clock Buffer for PCIe 6.0 and UPI

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Description

The PI6CBE33045 is a low-power PCIe® 1.0/2.0/3.0/ 4.0/5.0/6.0 clock buffer. It takes a reference input to fanout four 100MHz low-power differential HCSL outputs with on-chip terminations for 85Ω output impedance. It supports both zero-delay and fanout buffer functions for various applications. An individual OE pin for each output provides easier power management.

It uses Diodes proprietary PLL design to achieve very-low jitter that meets PCIe 1.0/2.0/3.0/4.0/5.0/6.0 requirements.

Feature(s)

  • Four Differential Low-Power HCSL Outputs with On-Chip Termination
  • Default ZOUT = 85Ω
  • Spread Spectrum Tolerant
  • Individual Output Enable
  • Selectable PLL Bandwidths
  • Hardware/SMBus Control of ZDB and Fanout Buffer Modes
  • 1–400MHz Fanout Buffer Operation
  • Differential Output-to-output Skew <50ps
  • Very Low Jitter Outputs
    • Differential Cycle-to-cycle Jitter <50ps
    • Fanout Buffer Mode Additive Phase Jitter:
      • PCIe 6.0 CC: 0.012 ps
      • DB2000Q Additive Jitter: 0.02ps
    • ZDB Mode Phase Jitter:
      • PCIe 6.0 CC: RMS 0.01 ps
      • QPI/UPI 11.4GB/s: 0.14ps RMS
      • IF-UPI: RMS 0.15 ps
  • Core Supply Voltage: 3.3V
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/
  • Packaging (Pb-free & Green):
    • 32-pin, 5mm × 5mm TQFN (ZH)

Product Specifications

Product Parameters

Compliance (Only Automotive(Q) supports PPAP) Standard
Function PCIe clock buffer
Number of Outputs 4
Output Type(s) HCSL
Maximum Output Frequency (MHz) FOB mode up to 400MHz
Additive Jitter (ps) FOB mode 0.0074
Supply Voltage (V) 3.3
Input Type(s) HCSL
Skew (PS) 50
Ambient or Junction Temperature (°C) -40 to 85

Technical Documents

Application Information

SPICE/IBIS Model Documents

Recommended Soldering Techniques

TN1.pdf