Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.
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| @ TerminalTemperature TT (ºC) | - |
|---|---|
| AEC Qualified | Yes |
| Compliance (Only Automotive supports PPAP) | Standard |
| Configuration | Single |
| Maximum Average Rectified Current IO (A) | 2 |
| Peak Repetitive Reverse Voltage VRRM (V) | 150 |
| Peak Forward Surge Current IFSM (A) | 42 |
| Forward VoltageDrop VF(V) | 0.8 |
| @ IF (A) | 2 |
| Maximum Reverse Current IR (μA) | 75 |
| @ VR (V) | 150 |
| Reverse Recovery Time trr (ns) | - |
| Total Capacitance CT (pF) | - |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2691 | 2024-08-16 | 2024-11-14 | Additional Wafer Sources and Transfer of Wafer Manufacturing Site for Select Discrete Products |
| PCN-2542 | 2021-08-30 | 2021-11-30 | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products in SMA Package |
| PCN-2398 | 2019-05-21 | 2019-08-21 | Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products |
