Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.
SMC.png
Contact Sales
Log in or register to manage email notifications about changes to datasheets or PCNs for this part.
| Compliance (Only Automotive supports PPAP) | Standard |
|---|---|
| AEC Qualified | No |
| Product Type | ULTRA-FAST RECOVERY RECTIFIER |
| Configuration | Single |
| MaximumAverageRectifiedCurrent IO (A) | 3 A |
| Maximum Peak Forward Surge Current IFSM (A) | 120 A |
| Peak RepetitiveReverse VoltageVRRM (V) | 1000 V |
| Forward VoltageDrop VF(V) | 1.8 V |
| @ IF (A) | 3 A |
| Maximum ReverseCurrent IR (µA) | 10 µA |
| @ VR (V) | 1000 V |
| Reverse RecoveryTime trr (ns) | 85 ns |
| TotalCapacitance CT (pF) | 25 pF |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2701 | 2024-11-18 | 2025-02-17 | Transfer of Wafer Manufacturing Site and Additional Wafer Source for Select Discrete Products |
| PCN-2588 | 2022-06-01 | 2022-09-01 | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products |
| PCN-2398 | 2019-05-21 | 2019-08-21 | Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products |
| PCN-2337 | 2018-06-04 | 2018-05-04 | Qualification of Additional Wafer Sources and Additional Assembly and Test Sites for Select Products |
