* DIODES INCORPORATED AND ITS AFFILIATED COMPANIES AND SUBSIDIARIES (COLLECTIVELY, "DIODES") * PROVIDE THESE SPICE MODELS AND DATA (COLLECTIVELY, THE "SM DATA") "AS IS" AND WITHOUT ANY * REPRESENTATIONS OR WARRANTIES, EXPRESS OR IMPLIED, INCLUDING ANY WARRANTY OF MERCHANTABILITY * OR FITNESS FOR A PARTICULAR PURPOSE, ANY WARRANTY ARISING FROM COURSE OF DEALING OR COURSE OF * PERFORMANCE, OR ANY WARRANTY THAT ACCESS TO OR OPERATION OF THE SM DATA WILL BE UNINTERRUPTED, * OR THAT THE SM DATA OR ANY SIMULATION USING THE SM DATA WILL BE ERROR FREE. TO THE MAXIMUM * EXTENT PERMITTED BY LAW, IN NO EVENT WILL DIODES BE LIABLE FOR ANY DIRECT OR INDIRECT, * SPECIAL, INCIDENTAL, PUNITIVE OR CONSEQUENTIAL DAMAGES ARISING OUT OF OR IN CONNECTION WITH * THE PRODUCTION OR USE OF SM DATA, HOWEVER CAUSED AND UNDER WHATEVER CAUSE OF ACTION OR THEORY * OF LIABILITY BROUGHT (INCLUDING, WITHOUT LIMITATION, UNDER ANY CONTRACT, NEGLIGENCE OR OTHER * TORT THEORY OF LIABILITY), EVEN IF DIODES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES, * AND DIODES' TOTAL LIABILITY (WHETHER IN CONTRACT, TORT OR OTHERWISE) WITH REGARD TO THE SM * DATA WILL NOT, IN THE AGGREGATE, EXCEED ANY SUMS PAID BY YOU TO DIODES FOR THE SM DATA. *---------- DMTH41M2SPSQ_RC Spice Model ---------- .SUBCKT DMTH41M2SPSQ_RC 100 200 300 500 600 * TERMINALS : D G S TJ TA * TJ : Junction TEMPERATURE (degC) * TA : MOUNTING BASE TEMPERATURE (degC) * MODEL FORMAT : SPICE3 **************Foster(RC) Thermal Model************** * Editor : Stan Li VD 100 10 0 VG 200 20 0 VS 300 30 0 Vj 500 50 0 Vamb 600 60 0 Gth 0 50 value = {i(VD)*v(10)+v(20)*i(VG)+v(30)*i(VS)} RTH1 50 51 4.324E-007 RTH2 51 52 0.01197 RTH3 52 53 0.2603 RTH4 53 54 0.7616 RTH5 54 55 0.03312 RTH6 55 60 0.004196 CTH1 50 51 1.586E-008 CTH2 51 52 0.0005638 CTH3 52 53 0.03095 CTH4 53 54 0.04398 CTH5 54 55 0.007357 CTH6 55 60 0.0001677 *Diodes Foster(RC) Thermal Model v1.0 Last Revised 2023/05/08 *Self heating is ignored *TJ is output, please floating *TA node has to be connected to a constant voltage source Vdc representing the ambient temperature. *************************************************** * Editor : Stan Li M1 1 2 3 3 NMOS L = 1E-006 W = 1E-006 RD 10 1 1E-006 RS 30 3 1E-006 RG 20 2 3.64 CGS 2 3 1.162E-008 EGD 12 0 2 1 1 VFB 14 0 0 FFB 2 1 VFB 1 CGD 13 14 1.4E-009 R1 13 0 1 D1 12 13 DLIM DDG 15 14 DCGD R2 12 15 1 D2 15 0 DLIM DSD 3 10 DSUB .MODEL NMOS NMOS LEVEL = 3 VMAX = 1E+005 ETA = 0 VTO = 3.57 TOX = 1E-007 + NSUB = 1E+016 KP = 201.5 U0 = 500 KAPPA = 0.2 IS = 0 .MODEL DCGD D CJO = 1.2E-009 VJ = 0.8 M = 0.6155 .MODEL DSUB D IS = 6.5E-009 N = 1.341 RS = 4.441E-010 BV = 42.47 + CJO = 7.3E-009 VJ = 0.9 M = 0.343 XTI = 0 TT = 3E-008 .MODEL DLIM D IS = 0.0001 .ENDS *Diodes Spice Model v1.2 Last Revised 2023/05/08 *The model is an approximation of the device, and it may not show the true device performance under all conditions. *The model only guarantees the accuracy of the key parameters (Ron, VSD, IDSS, Ciss, Coss, Crss, and Trr) at 25 degC in the current data sheet.