| PCN |
Compliance Date |
| G5E100B polyimide wafer for improving the stress distribution of the product |
2020-12-11 |
| Qualification WMEC as an additional assembly site to manufacturing DPAK LTTH806LDW device |
2020-12-04 |
| Add 2nd sourcen molding compound EME-G630AY on F5 product for better delivery from Taiwan |
2020-04-17 |
| Qualification Anxin 4" Fab is Alternative SGPP Wafer Sources for Bridge Rectifier Products |
2020-04-01 |
| Add lot trace code in laser marking for F5 product |
2020-03-13 |
| Add trace code in laser Marking for G20100CF5 & SR2506F5 F5 Product |
2020-03-13 |
| TO-252 C1045DW Site Change From Outsourcing to WMEC |
2020-03-13 |
| TO220 & ITO220 AC LF changes from 3pin to 2pin. |
2020-02-26 |
| SMD B3200B product Planarwafer IR improvement |
2020-02-26 |
| APD manufacture site transfer from SSEC to AM |
2019-05-24 |
| Improve product traceability |
2019-05-24 |
| ABS20MH device add Kexin wafer as the 2nd source. |
2019-04-10 |
| APD DO-15 SIDAC double convex slug change |
2018-10-18 |
| Delta-Pachinko product laser marking change |
2018-10-16 |
| Planar wafer IR improvement |
2018-10-16 |
| End of Life for MB130L, B130L, B130LB products |
2018-07-05 |
| End of Life for G30100CE product |
2018-07-03 |
| F3-D Product Marking DC Change / Marking Appearance Layout Change From 2 rows To 3 rows |
2018-06-20 |
| SMD change TVS Die size from 56mil to 60mil |
2018-06-20 |
| End of Life for 20SQ45DG,SL2050DG,SL20H50DG,20SQ50CG products |
2018-05-22 |
| Change SMB 6Row to 16Row design |
2018-05-22 |
| End of Life for SBL6030PT, MBR6030PT, MBR6035PT,MBR6040PT, SBL6045PT, SBL6050PT, MBR6050PT product |
2018-04-16 |
| End of Life for SBL4030PT, MBR4030PT, SBL4035PT,MBR4035PT, MBR4040PT, SBL4050PT, MBR4050PT product |
2018-04-16 |
| End of Life for SBL3030PT, MBR3030PT, SBL3035PT,MBR3035PT, SBL3050PT, MBR3050PT, MBR3060PT,SBL3040PTS product |
2018-04-16 |
| End of Life for SBL2030PT, SBL2035PT,SBL2040PT, SBL2045PT, SBL2050PT, SBL2060PT product |
2018-04-16 |
| TO-Clip Bond Transfer Program from SSEC to WMEC |
2018-02-14 |
| TO247 Clip bond change to Wire bond |
2018-02-13 |
| S8XC clip size change |
2017-11-29 |
| End of Life for G15100F4 product |
2017-10-31 |
| ITO-220 Clip Shape Change PCN |
2017-09-27 |
| End of Life for SBL1630PT, SBL1635PT, SBL1640PT, SBL1645PT, SBL1650PT, SBL1660PT product |
2017-09-01 |
| 1N4148W/1N4148WS add assembly site Xinzhantong |
2017-07-14 |
| Modification of Tube for GBU Package |
2017-06-17 |
| Modification of Tube length for Bending Lead GBJ |
2017-06-12 |
| End of Life for MB130L, B130L and B230LHA products |
2017-05-02 |
| End of Life for MBRXX100CE, MBRXX120CE and 20SQ45CG products |
2017-04-21 |
| APD TVS Product Green Mold Compound Implement |
2016-12-28 |
| Change Clip Joint Method GPP / SCH |
2016-11-04 |
| End of Life for MBR10100CD/B140HB/MBRF2080CT /MBR2080CT products |
2016-09-02 |
| GBPC/KBPC Package Change Epoxy Type |
2016-06-15 |
| MURS360 MURS460C Implement Pedestal LDF |
2016-06-14 |
| End of Life for B8150C/FB2100M/B340AZ/B540HC products |
2016-05-30 |
| DO15 SIDAC add assembly site ML |
2016-05-03 |
| H105D add assembly site ML |
2016-04-18 |
| SMC SF GPP Implement Pedestal LDF MURS360 |
2016-04-18 |
| Add 2nd Source for new compound GPP-BRG |
2016-04-18 |
| LS4148 Series / LZ52CXX Series termination paste change from Ag to NiCr and thickness change |
2016-04-14 |
| Change Clip Joint Method - FB345D&FB3A45D |
2016-03-18 |
| The Clip Shape Change for ITO-220 Product |
2016-02-22 |
| End of Life for LVP640P product |
2015-08-25 |
| End of Life for LTTH1206D/LTTH1206DF |
2014-12-30 |
