Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.
SMB.pngSchottky
Contact Sales
Log in or register to manage email notifications about changes to datasheets or PCNs for this part.
| AEC Qualified | Yes |
|---|---|
| Compliance (Only Automotive supports PPAP) | Standard |
| Configuration | Single |
| MaximumAverageRectifiedCurrent IO (A) | 2 A |
| @ TerminalTemperature TT (ºC) | 100 ºC |
| Peak RepetitiveReverse VoltageVRRM (V) | 20 V |
| Peak ForwardSurge CurrentIFSM(A) | 50 A |
| Forward VoltageDrop VF(V) | 0.5 V |
| @ IF (A) | 2 A |
| Maximum ReverseCurrent IR (µA) | 500 µA |
| @ VR (V) | 20 V |
| TotalCapacitance CT (pF) | 200 pF |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2679 | 2024-04-01 | 2024-04-01 | Qualification of Additional Wafer Source for Select Discrete Products |
| PCN-2623 | 2023-05-15 | 2023-11-15 | Device End of Life (EOL) |
| PCN-2588 | 2022-06-01 | 2022-09-01 | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products |
| PCN-2550 | 2021-12-20 | 2022-06-20 | Device End of Life (EOL) |
| PCN-2530 | 2021-09-03 | 2021-12-03 | Addition of a Passivation Layer Over the Top Metal of the Die for Select Lite-On Semiconductor (LSC) Brand Products |
| PCN-2477 | 2020-08-17 | 2021-05-09 | Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi |
| PCN-2398 | 2019-05-21 | 2019-08-21 | Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products |
| PCN-2339 | 2018-06-15 | 2018-09-15 | Qualification of Additional Wafer Source for Select Products |
