BC847BLP

NPN, 45V, 0.1A, DFN1006-3

Datasheet

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Feature(s)

BV_CEO> 45V
I_C = 100mA High Collector Current
P_D = 1000mW Power Dissipation
60mm² Package Footprint, 13 Times Smaller Than SOT23
5mm Height Package Minimizing Off-Board Profile
Complementary PNP Type: BC857BLP
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/.
This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Product Specifications

Product Parameters

Category	Small Signal Transistor
Compliance(Only Automotive supports PPAP)	Standard
Polarity	NPN
VCEO, VCES (V)	45
IC (A)	0.1
ICM (A)	0.2
PD (W)	0.4
hFE (Min)	200
hFE (@ IC) (A)	0.002
h_FE(Min 2)	-
hFE (@ IC2) (A)	-
VCE(sat) Max (mV)	250
V_CE(SAT) (@ IC/IB) (A/mA)	0.01/0.5
VCE(sat) (Max.2) (mV)	600
VCE(sat) (@ IC/IB2) (A/mA)	0.1/5
fT (MHz)	100
RCE(sat) (mΩ)	-

Technical Documents

SPICE Model

BC847BLP.spice.txt

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

RoHSFile

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2461	2020-05-08	2021-04-05	Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site
PCN-2299	2018-03-01	2018-06-01	Additional Qualified (A/T) Assembly Test Site