Diodes Incorporated — Analog and discrete power solutions
Back to Data Line Protection

D12V0X1B2LP

12V ULTRA LOW CAPACITANCE BIDIRECTIONAL TVS DIODE

Contact Sales

Log in or register to manage email notifications about changes to datasheets or PCNs for this part.

Description

This new generation TVS is designed to protect sensitive electronics from the damage due to ESD. The combination of small size and high ESD surge capability makes it ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players.

Feature(s)

  • Low Profile Package (0.53mm Max) and Ultra-Small PCB Footprint Area (1.1mm x 0.7mm Max) Suitable for Compact Portable Electronics
  • Provides ESD Protection per IEC 61000-4-2 Standard:
    Air ±24kV, Contact ±20kV
  • 1 Channel of ESD Protection
  • Low Channel Input Capacitance
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAP
    capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/

Application(s)

  • Cellular Handsets
  • Portable Electronics
  • Computers and Peripheral

Product Specifications

Product Parameters

Compliance (Only Automotive supports PPAP) Standard
AEC Qualified No
Configuration Single (Bi-Directional)
Channel Input CapacitanceCT Typ (pF) 0.5 pF
Reverse Standoff Voltage VRWM(V) 12 V
Breakdown VoltageVBR Min(V) 13 V
Maximum Clamping Voltage @ Max Peak Pulse Current VC (V) 25 V
VESD IEC61000-4-2 Contact Discharge(kV) 20 kV

Technical Documents

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products