Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.

SOT26-Chip-Image.png

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DMMT5401

Dual PNP, 150V, 0.2A, SOT26

Datasheet

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Feature(s)

BV_CEO> -150V
I_C = -200mA High Collector Current
Pair of PNP Transistors That Are Intrinsically Matched (Note 1)
2% Matched Tolerance, h_FE, V_CE(sat), V_BE(sat)
Ideal for Medium Power Amplification and Switching
Fully Internally Isolated in a Small Surface-Mount Package
Epitaxial Planar Die Construction
Totally Lead-Free & Fully RoHS Compliant (Notes 2 & 3)
Halogen and Antimony Free. “Green” Device (Note 4)
For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/.
This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Product Specifications

Product Parameters

Category	High Voltage Transistor (Matched hFE, VCE(sat) & VBE(sat))
Compliance(Only Automotive supports PPAP)	Standard
Polarity	PNP + PNP
VCEO, VCES (V)	150
IC (A)	0.2
PD (W)	0.3
hFE (Min)	60
hFE (@ IC) (A)	0.01
h_FE(Min 2)	50
hFE (@ IC2) (A)	0.05
VCE(sat) Max (mV)	200
V_CE(SAT) (@ IC/IB) (A/mA)	0.01/1
VCE(sat) (Max.2) (mV)	500
VCE(sat) (@ IC/IB2) (A/mA)	0.05/5
fT (MHz)	100

Technical Documents

SPICE Model

DMMT5401.spice.txt

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

RoHSFile

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2495	2021-03-31	2021-07-01	Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products
PCN-2461	2020-05-08	2021-04-05	Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site