P-CHANNEL ENHANCEMENT MODE MOSFET
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This MOSFET is designed to minimize the on-state resistance (RDS(ON)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications.
AEC Qualified | Yes |
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Compliance (Only Automotive(Q) supports PPAP) | Standard |
Polarity | P |
ESD Diodes (Y|N) | No |
|VDS| (V) | 20 V |
|VGS| (±V) | 10 ±V |
|IDS| @TA = +25°C (A) | 9 |
PD @TA = +25°C (W) | 1.9 |
RDS(ON)Max@ VGS(4.5V)(mΩ) | 16 mΩ |
RDS(ON)Max@ VGS(2.5V)(mΩ) | 22 mΩ |
RDS(ON)Max@ VGS(1.8V)(mΩ) | 40 mΩ |
|VGS(TH)| Min (V) | 0.35 V |
|VGS(TH)| Max (V) | 1 V |
QG Typ @ |VGS| = 4.5V (nC) | 34 nC |
QG Typ @ |VGS| = 10V (nC) | 59 (@8V) nC |
CISS Typ (pF) | 2760 pF |
CISS Condition @|VDS| (V) | 15 V |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
PCN # | Issue Date | Implementation Date | Subject |
---|---|---|---|
PCN-2690 | 2024-05-29 | 2024-08-29 | Qualification of Diodes’ subcontractor Eris Technology Corporation (Eris) in Taoyuan, Taiwan as Additional Assembly & Test Site and Diodes internal JKFAB in HsinChu, Taiwan as additional wafer source for Select Discrete Products. |
PCN-2495 | 2021-03-31 | 2021-07-01 | Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products |