Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.
SOD123F.pngSBR
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| @ TerminalTemperature TT (ºC) | N/A |
|---|---|
| AEC Qualified | Yes |
| Compliance (Only Automotive supports PPAP) | Automotive |
| Configuration | Single |
| Maximum Average Rectified Current IO (A) | 2 |
| Peak Repetitive Reverse Voltage VRRM (V) | 60 |
| Peak Forward Surge Current IFSM (A) | 30 |
| Forward VoltageDrop VF(V) | 0.7 |
| @ IF (A) | 2 |
| Maximum Reverse Current IR (μA) | 0.8 |
| @ VR (V) | 60 |
| Reverse Recovery Time trr (ns) | N/A |
| Total Capacitance CT (pF) | N/A |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2661 | 2024-02-21 | 2024-05-21 | Qualification of Additional Wafer Source and Wafer Diameter Change |
| PCN-2590 | 2022-06-01 | 2022-09-01 | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products |
| PCN-2500 | 2021-03-24 | 2021-06-24 | Transfer Final Test and Packing from Eris Plant 1 in Taipei City, Taiwan to Eris Plant 2 in Taoyuan, Taiwan for Automotive Products |
