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| @ TerminalTemperature TT (ºC) | - |
|---|---|
| AEC Qualified | Yes |
| Compliance (Only Automotive supports PPAP) | Standard |
| Configuration | Single |
| Maximum Average Rectified Current IO (A) | 3 |
| Peak Repetitive Reverse Voltage VRRM (V) | 20 |
| Peak Forward Surge Current IFSM (A) | 66 |
| Forward VoltageDrop VF(V) | 0.39 |
| @ IF (A) | 3 |
| Maximum Reverse Current IR (μA) | 500 |
| @ VR (V) | 20 |
| Reverse Recovery Time trr (ns) | - |
| Total Capacitance CT (pF) | 1300 |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2660 | 2024-03-13 | 2024-06-13 | Qualification of Additional Wafer Source with Wafer Diameter and Mold Compound Changes for Select Discrete Products |
| PCN-2542 | 2021-08-30 | 2021-11-30 | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products in SMA Package |
| PCN-2398 | 2019-05-21 | 2019-08-21 | Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products |
