Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.
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| AEC Qualified | Yes |
|---|---|
| Compliance (Only Automotive supports PPAP) | Standard |
| Configuration | Single |
| MaximumAverageRectifiedCurrent IO (A) | 3 A |
| Peak RepetitiveReverse VoltageVRRM (V) | 45 V |
| Peak ForwardSurge CurrentIFSM(A) | 50 A |
| Forward VoltageDrop VF(V) | 0.48 |
| @ IF (A) | 3 A |
| Maximum ReverseCurrent IR (µA) | 150 µA |
| @ VR (V) | 45 V |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2542 | 2021-08-30 | 2021-11-30 | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products in SMA Package |
| PCN-2425 | 2019-10-04 | 2020-01-04 | Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and Additional Wafer Source for Select Products. |
| PCN-2398 | 2019-05-21 | 2019-08-21 | Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products |
| PCN-2379 | 2018-11-29 | 2019-02-28 | Additional qualified suppliers for solderable front metal and back grind/back metal |
