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SDM01U50CP3 (Obsolete)

0.1A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE

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Description

The SDM01U50CP3 is a 50-volt 100mA Schottky Barrier Diode that is optimized for low forward voltage drop and low leakage current. It’s housed in a compact Chip Scale Package (CSP) that occupies only 0.18mm2 board space. The low thermal resistance enables designers to meet design challenges of increasing efficiency while reducing board space. It is ideally suited for use in portable applications.

Feature(s)

  • 0.18mm2 Footprint, Off Board Profile of 0.275mm
  • Very Low Forward Voltage – Minimizes Power Dissipation Losses
  • Low Leakage – Maximizes Battery Power
  • Soft, Fast Switching Capability
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative.
    https://www.diodes.com/quality/product-definitions/

Application(s)

  • Blocking Diode
  • Reverse Protection Diode
  • Boost Diode

Product Specifications

Product Parameters

@ IF (A) 100
@ IF(mA) 100
@ VR (V) 50
Compliance (Only Automotive supports PPAP) Standard
Capacitance CTOT Typ (pF) 7.5
Configuration Single
Forward Continuous Current IFM (mA) 100
Forward VoltageDrop VF(V) 0.5
Maximum ReverseCurrent IR (µA) 25
Peak RepetitiveReverse VoltageVRRM (V) 50
AEC Qualified No

Related Content

Packages

Applications

Technical Documents

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2623 2023-05-15 2023-11-15 Device End of Life (EOL)
PCN-2560 2021-12-16 2021-12-16 Additional Wafer Source (GFAB) and Additional Assembly and Test Site (SAT)