Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.

PowerDI5060-8.png

Back to MOSFET Master Table

DMP26M1UPS

20V P-CHANNEL ENHANCEMENT MODE MOSFET

Datasheet

Contact Sales

Description

This new generation MOSFET is designed to minimize RDS(ON) and yet maintain superior switching performance. This device is ideal for use in Notebook battery power management and load switches.

Feature(s)

Thermally Efficient Package-Cooler Running Applications
High Conversion Efficiency
Low RDS(ON) – Minimizes On State Losses
100% Unclamped Inductive Switching (UIS) Test in Production — Ensures More Reliable and Robust End Application
<1.1mm Package Profile – Ideal for Thin Applications
Lead-Free Finish; RoHS Compliant
Halogen- and Antimony-Free. “Green” Device
For automotive applications requiring specific change control
(i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and
manufactured in IATF 16949 certified facilities), please
contact us or your local Diodes representative.
https://www.diodes.com/quality/product-definitions/

Application(s)

• Load Switches
• Power Management Functions

Product Specifications

Product Parameters

AEC Qualified	No
Compliance (Only Automotive(Q) supports PPAP)	Standard
Polarity	P
ESD Diodes (Y\|N)	No
\|V_DS\| (V)	20 V
\|V_GS\| (±V)	10 ±V
\|I_DS\| @T_C = +25°C (A)	90
P_D @T_A = +25°C (W)	2.76
R_DS(ON)Max@ V_GS(4.5V)(mΩ)	6 mΩ
R_DS(ON)Max@ V_GS(2.5V)(mΩ)	8 mΩ
\|V_GS(TH)\| Min (V)	0.4 V
\|V_GS(TH)\| Max (V)	1 V
Q_G Typ @ \|V_GS\| = 4.5V (nC)	75 nC
Q_G Typ @ \|V_GS\| = 10V (nC)	164 nC
C_ISS Typ (pF)	5392 pF
C_ISS Condition @\|V_DS\| (V)	10 V

Technical Documents

SPICE Model

DMP26M1UPS.spice.txt

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2495	2021-03-31	2021-07-01	Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products