NRND = Not Recommended for New Design
50V N-CHANNEL ENHANCEMENT MODE MOSFET
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This MOSFET is designed to minimize the on-state resistance (RDS(ON)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications.
Compliance (Only Automotive supports PPAP) | On Request |
---|---|
CISS Condition @|VDS| (V) | 25 |
CISS Typ (pF) | 902.7 |
Compliance (Only Automotive(Q) supports PPAP) | Standard |
ESD Diodes (Y|N) | No |
|IDS| @TA = +25°C (A) | 9.1 |
PD @TA = +25°C (W) | 1.97 |
Polarity | N |
QG Typ @ |VGS| = 10V (nC) | 14 |
QG Typ @ |VGS| = 4.5V (nC) | 6.1 |
AEC Qualified | Yes |
RDS(ON)Max@ VGS(10V)(mΩ) | 15 |
RDS(ON)Max@ VGS(4.5V)(mΩ) | 23 |
|VDS| (V) | 50 |
|VGS| (±V) | 16 |
|VGS(TH)| Max (V) | 2 |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
PCN # | Issue Date | Implementation Date | Subject |
---|---|---|---|
PCN-2690 | 2024-05-29 | 2024-08-29 | Qualification of Diodes’ subcontractor Eris Technology Corporation (Eris) in Taoyuan, Taiwan as Additional Assembly & Test Site and Diodes internal JKFAB in HsinChu, Taiwan as additional wafer source for Select Discrete Products. |
PCN-2607 | 2023-02-22 | 2023-08-22 | Device End of Life (EOL) |
PCN-2495 | 2021-03-31 | 2021-07-01 | Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products |