Diodes Incorporated — Analog and discrete power solutions
SOD123F

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RS1MWF

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Description

The RS1MWF is a rectifier packaged in the small form factor, low profile SOD123F package. Providing fast recovery time for high efficiency, low reverse leakage current, and high surge current capability. This device is ideal for use in general rectification applications.

Feature(s)

  • Glass Passivated Die Construction
  • Small Form Factor, Low Profile
  • Fast Recovery Time for High Efficiency
  • Surge Overload Rating to 30A Peak
  • Low Reverse Leakage Current
  • High Reverse Breakdown Voltage
  • Lead-Free Finish; RoHS Compliant
  • Halogen and Antimony Free. “Green” Device

Application(s)

  • Switching Mode Power Supplies
  • DC-DC Converters
  • AC-DC Adaptors/Chargers
  • Mobile Devices

Product Specifications

Product Parameters

Compliance (Only Automotive supports PPAP) Standard
AEC Qualified Yes
Product Type FAST RECOVERY RECTIFIER
Configuration Single
MaximumAverageRectifiedCurrent IO (A) 1 A
Maximum Peak Forward Surge Current IFSM (A) 30 A
Peak RepetitiveReverse VoltageVRRM (V) 1000 V
Forward VoltageDrop VF(V) 1.3 V
@ IF (A) 1 A
Maximum ReverseCurrent IR (µA) 5 µA
@ VR (V) 1000 V
Reverse RecoveryTime trr (ns) 500 ns
TotalCapacitance CT (pF) 8 pF

Related Content

Packages

Applications

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2701 2024-11-18 2025-02-17 Transfer of Wafer Manufacturing Site and Additional Wafer Source for Select Discrete Products
PCN-2588 2022-06-01 2022-09-01 Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional
Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products
PCN-2561 2022-02-17 2022-08-17 Device End of Life (EOL)
PCN-2337 2018-06-04 2018-05-04 Qualification of Additional Wafer Sources and Additional Assembly and Test Sites for Select Products