Diodes Incorporated — Analog and discrete power solutions
W QFN3040 20

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.

W-QFN3040-20.png
Back to USB Type-C and USB Power Delivery IC

AP25810L

USB TYPE-C DFP CONTROLLER AND POWER SWITCH WITH LOAD DETECTION

Contact Sales

Log in or register to manage email notifications about changes to datasheets or PCNs for this part.

Description

The AP25810L device is a USB-C® downstream-facing port (DFP) controller with an integrated 3A rated USB power switch. The AP25810L device monitors the Type-C configuration channel (CC) lines to determine when a USB device is attached. If an upstream-facing port (UFP) device is attached, the AP25810L device applies power to the VBUS and communicates the selectable VBUS current-sourcing capability to the UFP via the pass-through CC line. If the UFP is attached using an electronically marked cable, the AP25810L device also applies VCONN power to the cable CC pin. The AP25810L device also identifies when Type-C audio or debug accessories are attached. The AP25810L device draws less than 0.7μA (typ) when no device is attached. Additional system power saving is achievable in the S4 and S5 system power states by using the output to disable the high-power 5V supply when no UFP is attached. In this mode, the device is capable of running from an auxiliary supply (AUX), which can be a lower-voltage supply (3.3V), typically powering the system μC in low-power states (S4 and S5). The AP25810L 30mΩ power switch has two selectable fixed-current limits that align with the Type‑C current levels. The  output signals when the switch is in an overcurrent or overtemperature condition. The  output controls power management to multiple high-current Type-C ports in an environment where all ports cannot simultaneously provide high current (3A). The AP25810L is available in a standard Green W-QFN3040-20 package with exposed PAD for improved thermal performance, and is RoHS-compliancy.

Feature(s)

  • USB-C Rev. 2.0 Compliant DFP Controller
  • Connector Attach or Detach Detection
  • STD, 1.5A or 3A Capability Advertisement on CC
  • Super-Speed Polarity Determination
  • VBUS Application and Discharge
  • VCONN Application to Electronically Marked Cable
  • Audio and Debug Accessory Identification
  • 7μA (typ) IDDQ When Port Is Unattached
  • Three Input Supply Options
    • IN1: USB Charging Supply
    • IN2: VCONN Supply
    • AUX: Device Power Supply
  • Power Wake Supports Low Power in System
    • Hibernate (S4) and OFF (S5) Power States
  • 30mΩ (typ) High-Side MOSFET
  • Programmable 1.7A or 3.4A ILIM (±7.1%)
  • Port Power Management Enables Power
    • Resource Optimization Across Multiple Ports
  • Transient Protection for CC1/CC2 Lines:
    • IEC 61000-4-2 Contact Discharge ±8 kV
    • IEC 61000-4-2 Air Gap Discharge ±15 kV
  • Thermally Efficient Low Profile Package
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen- and Antimony-Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/
  • An Automotive-Compliant Part is Available Under Separate Datasheet (AP25810LQ)

Product Specifications

Product Parameters

Compliance (Only Automotive(Q) supports PPAP) Standard
Protocols Supported USB Type C
Power Role DFP (Downstream-Facing Port) Source
I2C Support No
SR Controller Embedded No
VBUS MOS Embedded Yes
VCC Maximum Rating 5.5
VCC UVLO (V) 4.1

Related Content

Packages

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2595 2022-09-08 2022-12-08 Qualified Additional Wafer Fab Source, Die Revisions, Bill of Materials, and Data Sheet Changes