Diodes Incorporated — Analog and discrete power solutions
SMC

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SMC

SMC

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SMC

SMC

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SMC

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Description

  • Case: SMC
  • Case Material: Molded Plastic.
  • UL Flammability Classification Rating 94V-0
  • Moisture Sensitivity: Level 1 per J-STD-020D
  • Terminals: Lead-Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208
  • Polarity: Cathode Band or Cathode Notch
  • Weight: 0.21 grams (Approximate)

Feature(s)

  • Glass Passivated Die Construction
  • High Current Capability
  • Ultra-Fast Recovery Time for High Efficiency
  • Maximum Operating Junction Temperature of +175°C
  • Lead Free Finish; RoHS Compliant
  • Halogen and Antimony Free. “Green” Device

Application(s)

  • Power Supplies
  • Lighting Ballasts

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP) Standard
AEC Qualified No
Product Type ULTRA-FAST RECOVERY RECTIFIER
Configuration Single
MaximumAverageRectifiedCurrent IO (A) 3 A
Maximum Peak Forward Surge Current IFSM (A) 120 A
Peak RepetitiveReverse VoltageVRRM (V) 1000 V
Forward VoltageDrop VF(V) 1.8 V
@ IF (A) 3 A
Maximum ReverseCurrent IR (µA) 10 µA
@ VR (V) 1000 V
Reverse RecoveryTime trr (ns) 85 ns
TotalCapacitance CT (pF) 25 pF

Related Content

Packages

Applications

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Purchase & Availablity

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2701 2024-11-18 2025-02-17 Transfer of Wafer Manufacturing Site and Additional Wafer Source for Select Discrete Products
PCN-2588 2022-06-01 2022-09-01 Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional
Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products