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SMB.png3.0W SURFACE MOUNT POWER ZENER DIODE
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3.0W SURFACE MOUNT POWER ZENER DIODE
| AEC Qualified | No |
|---|---|
| Compliance (Only Automotive supports PPAP) | Standard |
| Configuration | Single |
| Power Rating(mW) | 3000 |
| Nom VZ (V) | 36 |
| @ IZT (mA) | 10.4 mA |
| Tol V (Typ) (%) | 5 % |
| IR (µA) | 1 µA |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2701 | 2024-11-18 | 2025-02-17 | Transfer of Wafer Manufacturing Site and Additional Wafer Source for Select Discrete Products |
| PCN-2588 | 2022-06-01 | 2022-09-01 | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products |
| PCN-2524 | 2021-10-04 | 2022-01-04 | Wafer Diameter Change from 4 inch to 5 inch at Yea Shin Technology Co., Ltd. (Yeashin Fab) and Qualification of Yea Shin Technology Co., Ltd. as Additional Wafer Source on Select Products |
| PCN-2431 | 2019-10-31 | 2020-01-31 | Qualification of Additional Wafer Source for Select Discrete Products |
| PCN-2398 | 2019-05-21 | 2019-08-21 | Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products |
