Diodes Incorporated — Analog and discrete power solutions
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2DD2661 (Obsolete)

NPN, 12V, 2A, SOT89

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Product Specifications

Product Parameters

Compliance (Only Automotive supports PPAP) On Request*
Category Medium Power Transistor
Compliance(Only Automotive supports PPAP) Standard
fT (MHz) 170
fT (MHz) 170
hFE (min) 270
hFE(@ IC) 0.2
hFE (@ IC) (A) 0.2
hFE(@ IC2) N/A
hFE (@ IC2) (A) -
hFE(Min 2) -
hFE (Min) 270
IC (A) 2
IC (A) 2
ICM (A) 4
ICM (A) 4
PD (W) 2
PD (W) 2
Polarity NPN
Product Type NPN
AEC Qualified Yes
RCE(SAT) N/A
RCE(sat) (mΩ) -
VCE (SAT) (@ IC/IB) (A/m A) 1/50
VCE (SAT) (@ IC/IB2) (A/mA) -
VCE (SAT)(Max.2) N/A
VCE (SAT)Max (mV) 180
VCE(SAT) (@ IC/IB) (A/mA) 1/50
VCE(sat) (@ IC/IB2) (A/mA) -
VCE(sat) (Max.2) (mV) -
VCE(sat) Max (mV) 180
VCEO, VCES (V) 12
VCEO, VCES (V) 12

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Technical Documents

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MDS Reports

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2502 2021-03-15 2021-09-15 Device End of Life (EOL)
PCN-2422 2019-11-26 2020-02-26 Addition of A Passivation Layer Over The Top Metal of The Die for Select BJT Products
PCN-2313 2019-10-21 2020-01-21 Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, Conversion
to Copper Bond Wire, and Qualification of Additional Die Passivation Layer on Select Products