Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.
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| AEC Qualified | Yes |
|---|---|
| Compliance (Only Automotive supports PPAP) | Standard |
| Configuration | Single |
| MaximumAverageRectifiedCurrent IO (A) | 1 A |
| @ TerminalTemperature TT (ºC) | 125 ºC |
| Peak RepetitiveReverse VoltageVRRM (V) | 80 V |
| Peak ForwardSurge CurrentIFSM(A) | 30 A |
| Forward VoltageDrop VF(V) | 0.79 V |
| @ IF (A) | 1 A |
| Maximum ReverseCurrent IR (µA) | 500 µA |
| @ VR (V) | 80 V |
| TotalCapacitance CT (pF) | 80 pF |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2623 | 2023-05-15 | 2023-11-15 | Device End of Life (EOL) |
| PCN-2550 | 2021-12-20 | 2022-06-20 | Device End of Life (EOL) |
| PCN-2542 | 2021-08-30 | 2021-11-30 | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products in SMA Package |
| PCN-2477 | 2020-08-17 | 2021-05-09 | Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi |
| PCN-2398 | 2019-05-21 | 2019-08-21 | Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products |
| PCN-2339 | 2018-06-15 | 2018-09-15 | Qualification of Additional Wafer Source for Select Products |
