Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.
SMA.png2.0A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER
Contact Sales
Log in or register to manage email notifications about changes to datasheets or PCNs for this part.
The B2100A is a single rectifier packaged in the low profile SMA package. Providing low VF and excellent high temperature stability this device is ideal for use in general rectification applications.
| AEC Qualified | No |
|---|---|
| Compliance (Only Automotive supports PPAP) | Standard |
| Configuration | Single |
| MaximumAverageRectifiedCurrent IO (A) | 2 A |
| @ TerminalTemperature TT (ºC) | N/A ºC |
| Peak RepetitiveReverse VoltageVRRM (V) | 100 V |
| Peak ForwardSurge CurrentIFSM(A) | 50 A |
| Forward VoltageDrop VF(V) | 0.79 V |
| @ IF (A) | 2 A |
| Maximum ReverseCurrent IR (µA) | 500 µA |
| @ VR (V) | 100 V |
| TotalCapacitance CT (pF) | 75 pF |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2623 | 2023-05-15 | 2023-11-15 | Device End of Life (EOL) |
| PCN-2542 | 2021-08-30 | 2021-11-30 | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products in SMA Package |
| PCN-2477 | 2020-08-17 | 2021-05-09 | Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi |
| PCN-2398 | 2019-05-21 | 2019-08-21 | Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products |
| PCN-2339 | 2018-06-15 | 2018-09-15 | Qualification of Additional Wafer Source for Select Products |
