Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.
smaf-3D-image.png
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| AEC Qualified | No |
|---|---|
| Compliance (Only Automotive supports PPAP) | Standard |
| Configuration | Single |
| MaximumAverageRectifiedCurrent IO (A) | 2 A |
| @ TerminalTemperature TT (ºC) | N/A ºC |
| Peak RepetitiveReverse VoltageVRRM (V) | 100 V |
| Peak ForwardSurge CurrentIFSM(A) | 75 A |
| Forward VoltageDrop VF(V) | 0.79 V |
| @ IF (A) | 2 A |
| Maximum ReverseCurrent IR (µA) | 10 µA |
| @ VR (V) | 100 V |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2613 | 2023-04-12 | 2023-07-12 | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products |
| PCN-2477 | 2020-08-17 | 2021-05-09 | Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi |
| PCN-2398 | 2019-05-21 | 2019-08-21 | Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products |
