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| AEC Qualified | Yes |
|---|---|
| Compliance (Only Automotive supports PPAP) | Standard |
| Configuration | Single |
| MaximumAverageRectifiedCurrent IO (A) | 2 A |
| @ TerminalTemperature TT (ºC) | 100 ºC |
| Peak RepetitiveReverse VoltageVRRM (V) | 20 V |
| Peak ForwardSurge CurrentIFSM(A) | 50 A |
| Forward VoltageDrop VF(V) | 0.5 V |
| @ IF (A) | 2 A |
| Maximum ReverseCurrent IR (µA) | 500 µA |
| @ VR (V) | 20 V |
| TotalCapacitance CT (pF) | 200 pF |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2679 | 2024-04-01 | 2024-04-01 | Qualification of Additional Wafer Source for Select Discrete Products |
| PCN-2623 | 2023-05-15 | 2023-11-15 | Device End of Life (EOL) |
| PCN-2530 | 2021-09-03 | 2021-12-03 | Addition of a Passivation Layer Over the Top Metal of the Die for Select Lite-On Semiconductor (LSC) Brand Products |
| PCN-2542 | 2021-08-30 | 2021-11-30 | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products in SMA Package |
| PCN-2477 | 2020-08-17 | 2021-05-09 | Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi |
| PCN-2450 | 2020-02-17 | 2020-05-17 | Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products |
| PCN-2398 | 2019-05-21 | 2019-08-21 | Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products |
| PCN-2339 | 2018-06-15 | 2018-09-15 | Qualification of Additional Wafer Source for Select Products |
