Diodes Incorporated — Analog and discrete power solutions
SMB

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SMB

SMB

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SMB

SMB

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SMB

Back to Schottky (.5A and Above)

B250Q

2.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER

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Specifications & Technical Documents

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive supports PPAP) Automotive
Configuration Single
MaximumAverageRectifiedCurrent IO (A) 2 A
@ TerminalTemperature TT (ºC) N/A ºC
Peak RepetitiveReverse VoltageVRRM (V) 50 V
Peak ForwardSurge CurrentIFSM(A) 50 A
Forward VoltageDrop VF(V) 0.7 V
@ IF (A) 2 A
Maximum ReverseCurrent IR (µA) 500 µA
@ VR (V) 50 V
Reverse RecoveryTime trr (ns) N/A ns
TotalCapacitance CT (pF) 200 pF

Related Content

Packages

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Purchase & Availablity

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2590 2022-06-01 2022-09-01 Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products
PCN-2500 2021-03-24 2021-06-24 Transfer Final Test and Packing from Eris Plant 1 in Taipei City, Taiwan to Eris Plant 2 in Taoyuan, Taiwan for
Automotive Products
PCN-2478 2020-08-13 2021-06-06 Additional Wafer Source (GFAB)