Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.

SOT23.png

Back to Schottky (Less than .5A)

BAS40

Schottky

Datasheet

Contact Sales

Description

200mA surface-mount Schottky Barrier Diode in SOT23 (Standard) package, offers low forward voltage drop and fast switching capability, designed with PN Junction Guard Ring for Transient and ESD Protection, totally lead-free finish and RoHS compliant, ”Green” device.

Feature(s)

Low Forward Voltage Drop
Fast Switching
PN Junction Guard Ring for Transient and ESD Protection
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
The BAS40Q/ -04Q/ -05Q/ -06Q are suitable for automotive applications requiring specific change control; these parts are AEC-Q101 qualified, PPAP capable, and manufactured in IATF16949 certified facilities. https://www.diodes.com/quality/product-definitions/

Product Specifications

Product Parameters

AEC Qualified	Yes
Compliance (Only Automotive supports PPAP)	Standard
Configuration	Single
Power Rating(mW)	350 mW
Peak RepetitiveReverse VoltageV_RRM(V)	40 V
Forward Continuous Current I_FM(mA)	200 mA
Forward VoltageDrop V_F(V)	0.38
@ I_F(mA)	1 mA
Maximum ReverseCurrent I_R(µA)	0.2 µA
@ V_R(V)	30 V
Capacitance C_TOT Typ (pF)	5 pF

Technical Documents

SPICE Model

BAS40.spice.txt

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

RoHSFile

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2690	2024-05-29	2024-08-29	Qualification of Diodes’ subcontractor Eris Technology Corporation (Eris) in Taoyuan, Taiwan as Additional Assembly & Test Site and Diodes internal JKFAB in HsinChu, Taiwan as additional wafer source for Select Discrete Products.
PCN-2623	2023-05-15	2023-11-15	Device End of Life (EOL)
PCN-2562	2022-01-04	2022-04-04	Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products
PCN-2491	2020-11-17	2021-05-17	Device End of Life (EOL)
PCN-2477	2020-08-17	2021-05-09	Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi
PCN-2478	2020-08-13	2021-06-06	Additional Wafer Source (GFAB)
PCN-2458	2020-07-01	2020-10-01	Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products
PCN-2459	2020-05-28	2020-11-28	Device End of Life (EOL)
PCN-2462	2020-05-08	2021-04-11	Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive)
PCN-2461	2020-05-08	2021-04-05	Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site