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BAS70

Schottky

Datasheet

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Description

The 70mA surface-mount Schottky Barrier Diode in SOT23 package, offers low-forward voltage drop and fast switching capability, designed with PN Junction Guard Ring for Transient and ESD Protection.

Feature(s)

Low Turn-On Voltage
Fast Switching
PN Junction Guard Ring for Transient and ESD Protection
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
The BAS70-04Q is suitable for automotive applications requiring specific change control; this part is AEC-Q101 qualified, PPAP capable, and manufactured in IATF 16949 certified facilities. https://www.diodes.com/quality/product-definitions/

Product Specifications

Product Parameters

AEC Qualified	Yes
Compliance (Only Automotive supports PPAP)	Standard
Configuration	Single
Power Rating(mW)	200 mW
Peak RepetitiveReverse VoltageV_RRM(V)	70 V
Forward Continuous Current I_FM(mA)	70 mA
Forward VoltageDrop V_F(V)	0.41
@ I_F(mA)	1 mA
Maximum ReverseCurrent I_R(µA)	0.1 µA
@ V_R(V)	50 V
Capacitance C_TOT Typ (pF)	2 pF

Technical Documents

SPICE Model

BAS70.spice.txt

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

RoHSFile

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2690	2024-05-29	2024-08-29	Qualification of Diodes’ subcontractor Eris Technology Corporation (Eris) in Taoyuan, Taiwan as Additional Assembly & Test Site and Diodes internal JKFAB in HsinChu, Taiwan as additional wafer source for Select Discrete Products.
PCN-2562	2022-01-04	2022-04-04	Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products
PCN-2550	2021-12-20	2022-06-20	Device End of Life (EOL)
PCN-2477	2020-08-17	2021-05-09	Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi
PCN-2478	2020-08-13	2021-06-06	Additional Wafer Source (GFAB)
PCN-2458	2020-07-01	2020-10-01	Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products
PCN-2459	2020-05-28	2020-11-28	Device End of Life (EOL)
PCN-2461	2020-05-08	2021-04-05	Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site