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Back to Schottky (Less than .5A)

BAT54

Schottky

Datasheet

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Description

200mA surface-mount Schottky Barrier Diode in SOT23 (Standard) package, offers low turn-on voltage and fast switching capability, designed with PN Junction Guard Ring for Transient and ESD Protection, totally lead-free finish and RoHS compliant, ”Green” device.

Feature(s)

Low Turn-on Voltage
Fast Switching
PN Junction Guard Ring for Transient and ESD Protection
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/
An automotive-compliant part is available under separate datasheet (BAT54Q /AQ /CQ /SQ)

Product Specifications

Product Parameters

AEC Qualified	Yes
Compliance (Only Automotive supports PPAP)	Standard
Configuration	Single
Power Rating(mW)	330 mW
Peak RepetitiveReverse VoltageV_RRM(V)	30 V
Forward Continuous Current I_FM(mA)	200 mA
Forward VoltageDrop V_F(V)	0.32
@ I_F(mA)	1 mA
Maximum ReverseCurrent I_R(µA)	2 µA
@ V_R(V)	25 V
Capacitance C_TOT Typ (pF)	10 pF

Technical Documents

SPICE Model

BAT54.spice.txt

MDS Reports

BAT54_A_S_MDS.pdf (17 KB)

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

RoHSFile

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2690	2024-05-29	2024-08-29	Qualification of Diodes’ subcontractor Eris Technology Corporation (Eris) in Taoyuan, Taiwan as Additional Assembly & Test Site and Diodes internal JKFAB in HsinChu, Taiwan as additional wafer source for Select Discrete Products.
PCN-2623	2023-05-15	2023-11-15	Device End of Life (EOL)
PCN-2562	2022-01-04	2022-04-04	Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products
PCN-2491	2020-11-17	2021-05-17	Device End of Life (EOL)
PCN-2477	2020-08-17	2021-05-09	Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi
PCN-2458	2020-07-01	2020-10-01	Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products
PCN-2459	2020-05-28	2020-11-28	Device End of Life (EOL)
PCN-2461	2020-05-08	2021-04-05	Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site
PCN-2339	2018-06-15	2018-09-15	Qualification of Additional Wafer Source for Select Products