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BAV20WS

switching diode

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Feature(s)

  • Fast Switching Speed
  • Surface Mount Package Ideally Suited for Automated Insertion
  • For General Purpose Switching Applications
  • High Reverse Breakdown Voltage
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/.
  • This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive supports PPAP) Standard
Configuration Single
Polarity Anode, Cathode
Power Rating(mW) 200 mW
ESD Diodes (Y|N) No
Peak RepetitiveReverse VoltageVRRM (V) 150 V
Reverse RecoveryTime trr (ns) 50 ns
Maximum Average Rectifier Current IO (mA) 200 mA
Maximum Peak Forward Surge Current IFSM (A) 2.5 A
Forward Voltage Drop VF @ IF (mA) 1 mA
Maximum ReverseCurrent IR (µA) 0.1 µA
TotalCapacitance CT (pF) 5 pF
V(BR)R (V) Min @IR=100μA 200
Trr(ns) Max @ IF=IR=10 mA, Irr=0.1xIR, RL=100Ω 50
Maximum Reverse Current IR @ VR (V) 150 V
VF(V) Max @ IF=1.0mA 0.715
VF(V) Max @ IF=10mA 0.855
IR(uA) Max @ VR=80V 100nA@200V
CT(pF) Max @ VR = 0V, f = 1MHz 5

Related Content

Packages

Technical Documents

SPICE Model

MDS Reports

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2592 2022-09-12 2022-12-12 Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test (A/T) Site Using PdCu Bond Wire and New Lead Frame for Select Products
PCN-2544 2021-10-05 2022-01-05 Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Products
PCN-2315 2018-03-09 2018-06-09 Qualification of Alternative Wafer Sources for Select Products Due to Closure of Diodes FabTech (KFAB) Facility