Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.
SOD123-3D-image.pngNRND = Not Recommended for New Design
SURFACE MOUNT LOW LEAKAGE DIODE
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| Compliance (Only Automotive supports PPAP) | Automotive |
|---|---|
| Configuration | Single |
| CT(pF) Max @ VR = 0V, f = 1MHz | 5 |
| ESD Diodes (Y|N) | No |
| Forward Voltage Drop VF @ IF (mA) | 1.25V @ 200 |
| Maximum Average Rectifier Current IO (mA) | 225 |
| Maximum Peak Forward Surge Current IFSM (A) | 4 |
| Maximum ReverseCurrent IR (µA) | 0.1 |
| Maximum Reverse Current IR @ VR (V) | 240 |
| Peak RepetitiveReverse VoltageVRRM (V) | 350 |
| Polarity | Cathode Bar |
| Power Rating(mW) | 400 |
| AEC Qualified | Yes |
| Reverse RecoveryTime trr (ns) | 50 |
| TotalCapacitance CT (pF) | 5 |
| V(BR)R (V) Min @IR=100μA | 350 |
| V(BR)R (V) Min (µA) | 350 |
| VF(V) Max @ IF=100mA | 1 |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2614 | 2023-02-23 | 2023-08-23 | Device End of Life (EOL) - Automotive |
| PCN-2545 | 2021-10-05 | 2022-01-05 | Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Automotive Products |
| PCN-2462 | 2020-05-08 | 2021-04-11 | Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive) |
| PCN-2319 | 2018-03-09 | 2018-06-09 | Qualification of Alternative Wafer Sources for Select Automotive Products Due to Closure of Diodes FabTech (KFAB) Facility |
