Switching Diode
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Compliance (Only Automotive supports PPAP) | Standard |
---|---|
Configuration | Dual-Dual, Series (Alt.) |
CT(pF) Max @ VR = 0V, f = 1MHz | 2 |
ESD Diodes (Y|N) | No |
Forward Voltage Drop VF @ IF (mA) | 50, 1 |
IR(nA) Max @ VR=5V | 10 |
IR(µA) Max @ VR=30V | 0.1 |
IR(uA) Max @ VR=80V | 2.5uA@75V |
Maximum Average Rectifier Current IO (mA) | 300 |
Maximum Peak Forward Surge Current IFSM (A) | 3 |
Maximum ReverseCurrent IR (µA) | 2.5 |
Maximum Reverse Current IR @ VR (V) | 75 |
Peak RepetitiveReverse VoltageVRRM (V) | 75 |
Polarity | Anode, Cathode |
Power Rating(mW) | 500 |
AEC Qualified | Yes |
Reverse RecoveryTime trr (ns) | 4 |
TotalCapacitance CT (pF) | 2 |
Trr(ns) Max @ IF=IR=10 mA, Irr=0.1xIR, RL=100Ω | 4 |
Trr(ns) Max @ IF=IR=10 mA, Irr=0.1xIR, RL=100Ω | 4 |
V(BR)R (V) Min @IR=100μA | 75@2.5μA |
V(BR)R (V) Min (µA) | 75@2.5μA |
VF(V) Max @ IF=1.0mA | 0.7 |
VF(V) Max @ IF=100mA | 1.2 |
VF(V) Max @ IF=10mA | 0.82 |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
PCN # | Issue Date | Implementation Date | Subject |
---|---|---|---|
PCN-2623 | 2023-05-15 | 2023-11-15 | Device End of Life (EOL) |
PCN-2461 | 2020-05-08 | 2021-04-05 | Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site |
PCN-2315 | 2018-03-09 | 2018-06-09 | Qualification of Alternative Wafer Sources for Select Products Due to Closure of Diodes FabTech (KFAB) Facility |