Diodes Incorporated — Analog and discrete power solutions
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BZT52C13LPQ

SURFACE MOUNT ZENER DIODE

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Feature(s)

  • Ultra-Small Leadless Surface Mount Package
  • Ideally Suited for Automated Assembly Processes
  • Totally Lead-Free & Fully RoHS Compliant 
  • Halogen and Antimony Free. “Green” Device

Application(s)

  • Automotive Networking
  • Body Control Module
  • Chassis Control Unit
  • Exterior Light
  • Infotainment
  • Interior Light
  • Power Train
  • Seat Control Module

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive supports PPAP) Automotive
Configuration Single
Power Rating(mW) 250
Nom VZ (V) 13.25
@ IZT (mA) 5 mA
Tol V (Typ) (%) 0.0642 %
IR (µA) 0.1 µA

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2656 2023-12-20 2024-03-20 Qualification of Additional Wafer Source Using Different Back Metal Composition and Thickness, and Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using Different Back Metal Composition and Thickness, PdCu Bond Wire, New Lead Frame, New Mold Compound Types for Select Automotive Products.
PCN-2462 2020-05-08 2021-04-11 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive)