SURFACE MOUNT ZENER DIODE
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| AEC Qualified | Yes |
|---|---|
| Compliance (Only Automotive supports PPAP) | Automotive |
| Configuration | Single |
| Power Rating(mW) | 200 |
| Nom VZ (V) | 4.7 |
| @ IZT (mA) | 5 mA |
| Tol V (Typ) (%) | 6.38 % |
| IR (µA) | 3 µA |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2656 | 2023-12-20 | 2024-03-20 | Qualification of Additional Wafer Source Using Different Back Metal Composition and Thickness, and Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using Different Back Metal Composition and Thickness, PdCu Bond Wire, New Lead Frame, New Mold Compound Types for Select Automotive Products. |
| PCN-2545 | 2021-10-05 | 2022-01-05 | Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Automotive Products |
| PCN-2462 | 2020-05-08 | 2021-04-11 | Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive) |
| PCN-2319 | 2018-03-09 | 2018-06-09 | Qualification of Alternative Wafer Sources for Select Automotive Products Due to Closure of Diodes FabTech (KFAB) Facility |
