BZT585B3V9TQ

SURFACE MOUNT PRECISION ZENER DIODE

Datasheet

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Description

SURFACE MOUNT PRECISION ZENER DIODE

Feature(s)

±2.0% Tolerance on Breakdown Voltage
Small, Low Profile Surface Mount Package
Flat Lead Package Design for Low Profile and High Power Dissipation
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
PPAP Capable (Note 4)

Product Specifications

Product Parameters

AEC Qualified	Yes
Compliance (Only Automotive supports PPAP)	Automotive
Configuration	Single
Power Rating(mW)	350
Nom V_{Z (V)}	3.9
@ I_{ZT (mA)}	5 mA
Tol V (Typ) (%)	2 %
I_{R (µA)}	3 µA

Technical Documents

SPICE Model

BZT585B3V9TQ.spice.txt

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2522	2021-08-24	2021-11-24	Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly/Test Site Using PdCu or Cu Bond Wire with Standardization of Assembly Bill of Materials for Select Automotive Products
PCN-2462	2020-05-08	2021-04-11	Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive)