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D5V0L1B2LPS

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Description

This new generation TVS is designed to protect sensitive electronics from the damage due to ESD. The combination of small size and high ESD surge capability makes it ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. The sidewall plating option of this package allows optical inspection after soldering reflow for easy and reliable quality control.

Feature(s)

  • Low Profile Package (0.53mm max) and Ultra-Small PCB Footprint Area (1.08mm x 0.68mm max) Suitable for Compact Portable Electronics
  • Provides ESD Protection per IEC 61000-4-2 Standard: Air ±30kV, Contact ±30kV
  • One Channel of ESD Protection
  • Low Channel Input Capacitance
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • The D5V0L1B2LPSQ is suitable for automotive applications requiring specific change control; this part is AEC-Q101 qualified, PPAP capable, and manufactured in IATF16949 certified facilities. https://www.diodes.com/quality/product-definitions/

Application(s)

  • Cellular handsets
  • Portable electronics
  • Computers and peripherals

Product Specifications

Product Parameters

Compliance (Only Automotive supports PPAP) Standard
AEC Qualified Yes
Configuration Single (Bi-Directional)
Channel Input CapacitanceCT Typ (pF) 15 pF
Reverse Standoff Voltage VRWM(V) 5 V
Breakdown VoltageVBR Min(V) 6 V
Typ Reverse Leakage Current IR @ VRWM Max(µA) 0.01 µA
Maximum Clamping Voltage @ Max Peak Pulse Current VC (V) 12 V
VESD IEC61000-4-2 Contact Discharge(kV) 30 kV

Related Content

Packages

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products